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IBM said that they have created a low-power chipset that will compete with ultrawideband technology, offering data rates at around 630 Mbits/s.
The chipset conforms to the IEEE 802.15.3c specification, which IBM refers to as “millimeter wave” or “mmWave” technology. Using unlicensed spectrum around the 60-GHz range in the U.S. and Japan, the 630-Mbit mmWave technology demonstrated by IBM can transfer high-throughput content across distances of up to 10 meters.

IBM said that it had fabricated a prototype chipset — including the receiver, the transmitter, and two antennas, occupying the area of a dime. IBM used silicon germanium to manufacture the chips, a higher-performance but typically more expensive manufacturing process than the CMOS processes used by microprocessors and graphics chips.